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Hynix announces that they're building GDDR6 memory for a high-end video card in early 2018.

QuizzicalQuizzical Member LegendaryPosts: 25,355
edited April 2017 in Hardware
https://www.techpowerup.com/232659/sk-hynix-announces-its-8gb-gddr6-memory-chips

And probably enough specs on it to make someone mad.  Apparently the unspecified upcoming GPU has a 384-bit memory bus, with the memory rated at 16 Gbps, for 768 GB/s of memory bandwidth.  Hynix says that it's coming in "early 2018".

Nvidia has made lots of GPUs with a 384-bit memory bus, including the GeForce GTX 480, GTX 580, GTX 780 Ti, GTX 980 Ti, and GTX 1080 Ti.  So one could have guessed a top end GeForce card with a 384-bit GDDR6 memory bus would show up at some point.  That vague guess wouldn't tell you the timing of the launch, however.

AMD, meanwhile, nearly always goes with powers of 2 for their memory bus width.  They've only made one GPU ever with a 384-bit memory bus: the Tahiti chip of the Radeon HD 7970/7950.  And with AMD having already announced a move to HBM2 for their high end, to follow that with GDDR6 would seem like a downgrade.

Edit:  here's the press release straight form the original source:

https://www.skhynix.com/eng/pr/pressReleaseView.do?seq=2086&offset=1

Comments

  • HrimnirHrimnir Member RarePosts: 2,415
    My guess is it's gonna be Nvidia, I just don't see why AMD would move away from HBM/2 on their high end parts.

    "The surest way to corrupt a youth is to instruct him to hold in higher esteem those who think alike than those who think differently."

    - Friedrich Nietzsche

  • bhugbhug Member UncommonPosts: 944
    170501
    gddr6 2q18 @ 16Gbps, sk hynix, (768 GB/s in 384b I/O bus); nvidia volta

    HighBandwidthMemory (hbm stacks memory chips on top of each other around a central core, silicon vias [TSV] wires connect stacks, 2.5D architecture, emphasizes low clock rates and extremely wide bus) gddr5 refresh 201512; hbm2 1.2v IO/core v, 2-4-8 stack height, 256Gbps, overpriced;

     samsung theoretical hbm3 (high bandwidth + low cost) 2020 (? industry stability) vs gddr6; needs material that can tolerate +temp in large-scale die stacking; 10nm and 7nm nodes in EUV lithography

     ? vs micron ddr5 gddr5x (2D planar Silicon, 2q16) plans;


    image

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